TTM Technologies, Inc. is a leading global manufacturer of technology products, including mission systems, radio frequency (“RF”) components, RF microwave/microelectronic assemblies, and technologically advanced printed circuit boards (“PCB”s). TTM stands for time-to-market, representing how TTM's time-critical, one-stop design, engineering and manufacturing services enable customers to reduce the time required to develop new products and bring them to market. Scope: A Via Fill Operator will operate via fill and planarization equipment to create a superior bond between copper and increase functionality within core surfaces. A Via Fill Operator will also perform all necessary quality and process checks, daily housekeeping and minor preventative maintenance.
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Job Type
Full-time
Career Level
Entry Level
Education Level
High school or GED
Number of Employees
5,001-10,000 employees