Lead Product Engineer

Coherent Corp. • Sherman, TX

12d

About The Position

The Product Engineer will lead cross‑functional teams to investigate yield
excursions, identify root causes, and implement timely corrective and preventive
actions (CAPA) using industry‑standard engineering methodologies. You will own
yield bridge activities, supporting both new product introduction (NPI) and the
transition to high‑volume manufacturing, ensuring robust process scalability and
sustained yield performance.

Success in this role requires strong analytical capabilities, including the
ability to perform complex data queries, statistical analyses, and commonality
studies to drive effective troubleshooting and continuous yield improvement. The
ideal candidate is detail‑oriented, data‑driven, and thrives in a fast‑paced
environment focused on advanced photonics technology.

Requirements

• Hands-on experience with design, process, and characterization of optoelectronic device such as VCSEL, DFB laser, or photonic integrated chip.
• Strong statistical data analysis skills (JMP or Minitab etc.).
• Strong communication skills; adept at hosting effective meetings and facilitating actions and resolving conflicts.
• Strong ability to drive actions and solutions through cross-functional teams.

Nice To Haves

• Familiarity with semiconductor wafer fab operations (Manufacturing Execution System, process, and quality control, change management etc.) in a high-volume manufacturing environment is a plus.
• Experience with optoelectronic device reliability testing and modeling is a plus.

Responsibilities

• Support daily production like solving issues in real-time, as well as leading the analysis of failures on the wafer fabrication and testing production line.
• Work closely with R&D team to support new product introduction on next generation optoelectronic chips such as VCSEL, DFB laser, detector and photonic integrated chips for 3D sensing application.
• Perform design/process sensitivity study to define EPI/process spec limits. Coordinate correlation study between Chip, optical sub-assembly and transceiver modules to enhance design for manufacturability.
• Lead the efforts to drive production ramp-up readiness. Coordinate with cross-functional team (EPI, process, assembly, test etc) to ensure manufacturing readiness of chip design and specs, new equipment’s, process flow and specs, documentation and test database infrastructure etc.
• Lead cross-functional team to drive yield improvement and product cost reduction postproduction ramp. Perform statistical data analysis and trouble shoot potential root causes for yield excursions.
• Work closely with optical sub-assembly and transceiver module team to address issues at contract manufacturer that could be related to chip performance.
• Support cost modeling and facilitates actions / decisions towards designing and delivering cost-competitive products.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Education Level: Ph.D. or professional degree