Lab Technician, DPA (Destructive Physical Analysis) | EAG Laboratories

Eurofins USA Material Sciences•Irvine, CA

3d•Onsite

About The Position

The DPA Technician performs advanced analysis on integrated circuits, components, relays, connectors, and other electronic devices used in high reliability applications. This role requires a strong engineering mindset, high degree of attention to detail, ability to perform complex procedures, and hands-on proficiency in destructive and non-destructive techniques.

Requirements

This position works with companies that deal with defense-related activities and is subject to ITAR (International Traffic in Arms Regulations). All considered applicants must be U.S. Persons as defined by ITAR: U.S. Citizen U.S. Permanent Resident (i.e. “Green Card Holder”) Political Asylee or Refugee
AS degree in Electronics or other technical and science fields highly desired.
2+ years of direct experience in Destructive Physical Analysis (DPA), Semiconductor or Electronics Failure Analysis roles.
Expertise performing MIL-STD test methods: MIL-STD 883, MIL-STD 750, MIL-STD 1580.
Knowledge of and handling of electronics, integrated circuits, and components (e.g. resistors, capacitors, transformers, connectors, printed circuit boards, etc.).
High degree of manual dexterity.
Meticulous, detail oriented and highly organized.
Excellent written and verbal communication skills.
Optical and Digital Microscopy
X-ray (real-time/2D)
Scanning Acoustic Microscopy (C-SAM)
De-lidding of Ceramic and Hybrid IC packages
Chemical Etching (e.g. decapsulation, HF, BOE, delineation)
Deprocessing and Parallel Lapping
Plasma Etching (e.g. RIE, ICP, CF4, etc.).
Glassivation integrity testing
Cross Sectioning (e.g. metallurgical, mechanical, ion mill)
Scanning Electron Microscopy (SEM)
Energy Dispersive Spectroscopy (EDS)
Wire Bond Pull Testing
Die Shear Testing
Fine/Gross Leak Testing
Particle Impact Noise Detection (PIND)
Dye Penetrant Testing

Nice To Haves

Knowledge of other Industry Standards: e.g. ISO, AEC, JEDEC, IPC.
Device physics, circuits/schematics, IC design.
Operate electrical Bench test equipment (curve tracers, power supplies, ohm meters, o-scopes).
Familiarity of semiconductor fabrication and package manufacturing.
Software: GDS layout, LabView.
Electronics Failure Analysis techniques and methodology.

Responsibilities

Perform Destructive Physical Analysis (DPA) investigations per MIL-STD methods (e.g., MIL-STD-883, MIL-STD-750, MIL-STD-1580) to identify defects and assess reliability risks.
Perform advanced analysis using optical/digital microscopy, SEM/EDS, X-ray (2D/real-time), and C-SAM to characterize component construction and detect anomalies.
Conduct cross-sectioning, de-lidding, chemical/plasma etching, hermeticity testing, and other physical analysis techniques.
Support test plans for reliability assessments and root cause investigations in collaboration with multidisciplinary teams.
Implement new techniques and bring new tools online to enhance lab capabilities.
Analyze samples to identify failure initiation sites and construction anomalies.
Generate detailed technical reports and present findings to internal teams and customers.
Ensure compliance with industry standards (ISO, JEDEC, AEC, IPC) and customer specifications.
Interact with other technicians and engineers; mentor team members on best practices.
Maintain adherence to safety protocols, Technology Control Plan, and quality system requirements.
Protect confidential information and proprietary processes.