Intern - Thermal Modeling & Simulation

Micron Technology • Boise, ID

3h

About The Position

Research and develop thermal modeling techniques coordinated with simulation tools improved by artificial intelligence. Analyze thermal heat transfer challenges in advanced high-performance memory packaging. Propose design or process modifications to reduce thermal hotspots and improve reliability. Collaborate with multi-functional teams to validate solutions and implement improvements. Document findings and contribute to knowledge sharing within the engineering organization.

Requirements

• Currently pursuing a Master's or Ph.D. in Mechanical Engineering, Electrical Engineering, Computer Science, or related field.
• Strong understanding of heat transfer principles and thermal analysis.
• Proficiency in Python or similar programming languages for simulation and modeling.
• Familiarity with AI/ML concepts and their application in engineering simulations.
• Excellent analytical, problem-solving, and communication skills.
• Experience with thermal simulation tools (e.g., ANSYS, COMSOL, or similar).

Nice To Haves

• Knowledge of semiconductor packaging and advanced memory technologies.
• Hands-on experience applying AI/ML to engineering problems.
• Ability to work independently and deliver innovative solutions in a research environment.

Responsibilities

• Research and develop thermal modeling techniques coordinated with simulation tools improved by artificial intelligence.
• Analyze thermal heat transfer challenges in advanced high-performance memory packaging.
• Propose design or process modifications to reduce thermal hotspots and improve reliability.
• Collaborate with multi-functional teams to validate solutions and implement improvements.
• Document findings and contribute to knowledge sharing within the engineering organization.

What This Job Offers

• Career Level: Intern
• Education Level: Ph.D. or professional degree
• Number of Employees: 5,001-10,000 employees