About The Position

As an Advanced Package TD Process Integration Intern, you will work alongside experienced engineers to support the development of sophisticated interconnect technologies. This internship offers hands-on experience in problem-solving, line monitoring, data analysis, and project management, contributing directly to yield improvement and process optimization.

Requirements

  • Currently enrolled in an accredited university with expected graduation no earlier than Fall 2026
  • Excellent data extraction, analysis, and reporting skills (e.g., system analytics, JMP)
  • Strong collaboration and communication skills across multi-functional teams
  • Ability to prioritize multiple complex tasks and adapt to changing responsibilities
  • Tenacity to work under tight timelines and limited resources

Nice To Haves

  • Experience with semiconductor process integration or packaging technologies
  • Familiarity with structured problem-solving and decision-making frameworks
  • Exposure to experimental design and statistical analysis tools
  • Interest in advanced packaging and interconnect development

Responsibilities

  • Lead problem-solving activities using structured methodologies such as KT (Kepner-Tregoe)
  • Define and implement Design of Experiments (DoE) for process development
  • Present findings and collaborate across sites and teams
  • Support line monitoring through project management and yield improvement initiatives
  • Develop new line monitoring methods and critical metrics
  • Conduct experimental work using Micron systems and document outcomes
  • Analyze results and provide clear, actionable recommendations

Benefits

  • Choice of medical, dental and vision plans
  • Benefit programs that help protect your income if unable to work due to illness or injury
  • Paid family leave
  • Robust paid time-off program
  • Paid holidays

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What This Job Offers

Career Level

Intern

Education Level

Bachelor's degree

Number of Employees

5,001-10,000 employees

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