We are offering an exciting opportunity at SK Hynix USA for IC Packaging Thermal Analysis Intern to join our dynamic engineering team. In this position, you will work on advanced semiconductor packaging projects, gaining hands-on experience in thermal modeling and characterization of advanced packages. You will be introduced to the basics of the advanced package design and manufacturing process flow. This is a very exciting opportunity for a candidate aspiring to build up professional growth and be part of SK Hynix success.
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Career Level
Intern