Intern - HBM Design Engineering

Micron Technology • Richardson, TX

121d

About The Position

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. The Heterogeneous Integration Group (HIG) at Micron is shaping the future of AI and accelerated computing by developing advanced memory solutions. The team focuses on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML, high-performance computing (HPC), and data-centric systems, collaborating across global engineering and product teams to deliver industry-leading performance, power efficiency, and reliability. As an HBM Design Engineering Intern, you will contribute to the design, simulation, and optimization of digital and analog circuits for NextGen HBM products. You’ll work with cross-functional teams to translate architectural concepts into manufacturable silicon, applying data-driven methods and automation to improve performance, yield, and time-to-market.

Requirements

• Pursuing a degree in Electrical Engineering or a related field
• Strong foundation in CMOS circuit design and device physics
• Experience reading schematics, timing diagrams, and RTL
• Familiarity with FineSim and/or HSPICE, SystemVerilog, and scripting languages (Python/Tcl/Perl)
• Strong analytical problem-solving skills and ability to work in cross-disciplinary teams

Nice To Haves

• Familiarity with memory design (DRAM/HBM/SRAM) and SoC/IO interfaces
• Experience with data analysis or scripting to accelerate simulations (e.g., Python with NumPy or Pandas)
• Interest in EDA automation or applying ML techniques for design optimization
• Curiosity about AI’s impact on chip design and emerging tools
• Clear written and verbal communication skills

Responsibilities

• Design and analyze digital and analog circuits for advanced DRAM/HBM
• Contribute to floorplanning, parasitic modeling, and design validation/tape-out revisions
• Simulate and verify designs using tools like FineSim/HSPICE and SystemVerilog/UVM
• Build golden models and run corner/Monte Carlo analyses to ensure robust margins
• Optimize for power, performance, and area (PPA) using scripting and automation
• Collaborate with Product Engineering, Test/Probe, Process Integration, Assembly, and Marketing
• Standardize and automate design checks and flows with CAD and verification teams
• Explore new circuit topologies and EDA automation for future memory nodes

Benefits

• Choice of medical, dental and vision plans
• Programs that help protect your income if unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays

What This Job Offers

• Career Level: Intern
• Education Level: Bachelor's degree
• Number of Employees: 5,001-10,000 employees