Micron Technology-posted 2 months ago
Intern
Richardson, TX
5,001-10,000 employees

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. The DRAM and Emerging Memory Group (DEG) is a distributed team of engineers and innovators dedicated to redefining memory technology. The DEG team is committed to integrity, sustainability, and community impact while driving innovation in high-performance memory products. The position involves assisting HBM Architecture Interns in advancing High Bandwidth Memory (HBM) DRAM products using analog and digital circuit expertise.

  • Collaborate with HBM Build Architects on the composition and development of next-generation HBM DRAM products.
  • Apply analog/digital circuit development expertise in fields like memory arrays, high-speed interfaces, and custom logic.
  • Support multi-functional initiatives involving Build Engineering, Product Engineering, and Process Development.
  • Contribute to architectural decisions impacting high-performance computing and 2.5D/3D packaging.
  • Communicate technical findings and compose insights for internal teams and leadership.
  • Actively working towards a graduate degree or similar experience (Master’s or PhD or equivalent experience preferred) in Electrical Engineering, Computer Engineering, or a related domain.
  • Experience with CMOS circuit development and understanding of semiconductor device physics.
  • Knowledge of digital (Verilog) and/or analog (FastSpice, HSPICE) modeling and simulation.
  • Strong verbal and written communication skills.
  • Ability to synthesize and convey complex technical concepts effectively.
  • Experience in DRAM memory array composition, high-speed clocking/interface invention, or power delivery optimization.
  • Familiarity with 2.5D and 3D packaging technologies.
  • Familiarity with logic and tailored circuit composition methods.
  • Collaborative outlook with a proactive approach to problem-solving.
  • Previous internship or project experience in memory architecture or semiconductor development.
  • Choice of medical, dental and vision plans.
  • Benefit programs that help protect your income if unable to work due to illness or injury.
  • Paid family leave.
  • Robust paid time-off program.
  • Paid holidays.
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