Micron Technology is a global leader in memory and storage innovation, transforming how the world uses information to enrich life for all. The Advanced Packaging team is focused on developing next-generation packaging solutions that enable high-performance, high-density memory products for a wide range of applications. As an Advanced Packing Process Development (APTD) Intern at Micron Technology in Boise, you will be an integral part of a groundbreaking Technology Development (R&D) organization. You will be responsible for continuously improving and developing process and equipment to support Micron’s technology acceleration on next generation products. You will collaborate with teams across the company to develop new outstanding semiconductor devices. Your critical thinking and analytical skills will be challenged while you perform thorough process characterization, evaluate new hardware, and complete ground-breaking research. Your innovative thinking may lead to the next big invention to be added to Micron’s extensive patent portfolio. Come join us as we define the future of the semiconductor industry and transforming how the world uses information to enrich life.