Intern - APTD Equipment

Micron Technology • Boise, ID

5d

About The Position

Conduct research and development to support new advanced packaging solutions Plan and implement well-designed experiments and report findings clearly Drive continuous process improvements to meet yield, quality, and cycle time targets Collaborate with multi-functional teams to implement and monitor process changes

Requirements

• In progress of obtaining BS/MS in Mechanical Engineering, Material Science, Electrical Engineering, Chemical Engineering or a related field (Graduation date should not be prior to September 2026)
• Strong focus on detail and achieving goals
• Ability to proactively solve problems and adapt in a dynamic environment
• Proven experience or research in a semiconductor-related field
• Knowledge of statistics, mathematics, and machine learning algorithms
• Excellent interpersonal and communication skills (written, verbal, and presentation)
• Familiarity with semiconductor packaging processes or materials
• Demonstrated ability to work effectively in global, multi-functional teams
• Strong documentation and reporting skills

Nice To Haves

• Experience with data analysis tools such as JMP or similar platforms

Responsibilities

• Conduct research and development to support new advanced packaging solutions
• Plan and implement well-designed experiments and report findings clearly
• Drive continuous process improvements to meet yield, quality, and cycle time targets
• Collaborate with multi-functional teams to implement and monitor process changes

What This Job Offers

• Career Level: Intern