Intern - AI Hardware & Software (Summer 2026)

SK hynix AmericaSan Jose, CA
1d$26 - $50Onsite

About The Position

At SK hynix America, we're at the forefront of semiconductor innovation, developing advanced memory solutions that power everything from smartphones to data centers. As a global leader in DRAM and NAND flash technologies, we drive the evolution of advancing mobile technology, empowering cloud computing, and pioneering future technologies. Our cutting-edge memory technologies are essential in today's most advanced electronic devices and IT infrastructure, enabling enhanced performance and user experiences across the digital landscape. We're looking for innovative minds to join our mission of shaping the future of technology. At SK hynix America, you'll be part of a team that's pioneering breakthrough memory solutions while maintaining a strong commitment to sustainability. We're not just adapting to technological change – we're driving it, with significant investments in artificial intelligence, machine learning, and eco-friendly solutions and operational practices. As we continue to expand our market presence and push the boundaries of what's possible in semiconductor technology, we invite you to be part of our journey to creating the next generation of memory solutions that will define the future of computing.

Requirements

  • Currently enrolled in a Bachelor’s or Master’s program in Computer Science, Electrical Engineering, or related fields
  • Foundational knowledge of computer architecture, memory systems, and AI/ML concepts
  • Strong interest in AI infrastructure and memory technologies, with demonstrated analytical and problem-solving skills
  • Excellent collaboration and communication skills — comfortable working in cross-functional teams

Responsibilities

  • Analyze AI Ecosystem Components: Evaluate integration and performance impact across frameworks (PyTorch, TensorFlow), runtimes, compilers, and hardware (AI accelerators, GPUs, etc.)
  • Characterize AI Workloads: Analyze and classify key workload traits — including memory bandwidth requirements, access patterns, and compute intensity
  • Define & Map AI-Optimized Memory Solutions: Document technical components, key challenges, and emerging technologies — such as HBM, near-memory computing, 3D-stacked memory, CXL, and memory-centric architectures
  • Research Industry & Academic Trends: Survey and summarize memory architecture trends discussed by leading tech companies (Google, NVIDIA, Meta, AMD) and academic research communities

Benefits

  • Eligible interns will receive a housing allowance during their internship.
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