Join Micron’s Advanced Packaging Technology Development (TD) team, where innovation meets precision in developing next-generation interconnect technologies. Our team drives ground breaking solutions that enhance semiconductor performance and reliability. As an Advanced Package TD Process Intern, you will collaborate with experienced engineers to support the development of advanced interconnect technologies such as hybrid bonding and microbump technology, through Silicon Vias. This internship provides hands-on experience in problem-solving, line monitoring, data analysis, and project management, contributing directly to yield improvement and process optimization.
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Career Level
Intern
Education Level
Bachelor's degree
Number of Employees
5,001-10,000 employees