Interconnect Productization Lead, Annapurna Labs Machine Learning Acceleration

Amazon.com, Inc.•Cupertino, CA

64d

About The Position

AWS Utility Computing (UC) provides product innovations - from foundational services such as Amazon's Simple Storage Service (S3) and Amazon Elastic Compute Cloud (EC2), to consistently released new product innovations that continue to set AWS's services and features apart in the industry. As a member of the UC organization, you'll support the development and management of Compute, Database, Storage, Internet of Things (IoT), Platform, and Productivity Apps services in AWS, including support for customers who require specialized security solutions for their cloud services. Custom machine learning chips are at the heart of our Trainium machine learning instances, and we invite you to build them with us! As an Interconnect Productization Lead, you will be responsible for ensuring the correct operation and scalability of PCIe and other Interconnects used in our custom machine learning chips. You will work with architecture, IP owners, DV, software and signal integrity teams to productize the latest interconnect technology in both pre-silicon and post-silicon.

Requirements

Proficiency in PCIe, Memory(HBM, DDR), and other Interconnects.
5+ YoE in developing silicon, SW/HW co-design and pre-silicon environments.
Experience in post-silicon debugging/bring-up of high speed interfaces.

Nice To Haves

Proficiency in SoC architecture.
Proficiency in programming low-level programming and scripting.

Responsibilities

Gain a deep understanding of SoC architecture and interconnects.
Work with architecture, design, DV, SIPI and SW teams to verify and integrate interconnect functionality and performance.
Build verification environments for both pre-silicon and post-silicon.
Drive robust and stable high speed interface configurations in the data center.

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