We are seeking an experienced and hands-on IC Packaging Technologist to lead and innovate in the development of high-performance, high-speed, and advanced IC package solutions. The ideal candidate will bring a proven track record of deep technical contributions in 2.5D/3D packaging, signal and power integrity (SIPI), and chiplet technology, as well as experience scaling technologies to high-volume manufacturing. This role demands a deep understanding of advanced packaging architectures (such as CoWoS, interposers, WLP, and heterogeneous/chiplet integration) alongside strong expertise in SI and PI. The successful candidate will contribute to strategic roadmap execution and deliver package solutions into production.