We are looking for a self-motivated Packaging Simulation Engineer who is proficient in FEM simulation with multi-year FEM software ANSYS or ABAQUS. This position requires someone familiar with the development process of simulation and characterization projects, that thrives in a multifaceted collaborative organization. In this role, you will be working on stress and deformation simulation of IC packages to provide a comprehensive understanding of chip-package interaction and package-board interaction to ensure good device yield and reliability. You will also be working on scripting CAD/FEM software, and Generative-AI/Machine Learning/numerical tools to set up automated model-generation user interfaces.
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Career Level
Mid Level
Education Level
Bachelor's degree
Number of Employees
5,001-10,000 employees