IC Package Designer

Data Device Corporation • Bohemia, NY

161d • $130,000 - $170,000

About The Position

We are seeking a skilled and detail-oriented IC Package Designer to join our engineering team. The ideal candidate will have in-depth knowledge of substrate design, package layout, signal integrity, and manufacturing constraints. This role will collaborate cross-functionality with the electrical, mechanical and manufacturing design teams to develop reliable, manufacturable, and cost-effective package design.

Requirements

• Bachelor's degree in Electrical Engineering, Material science or related field.
• 8+ years of experience in IC package design and development.
• Experience with package design tools from concept through release (e.g., Cadence Allegro package designer).
• Proven experience with advanced packaging technologies (e.g., 2.5D/3D, redistribution layer, interposers, HBM integration, Package-in-Package, Fan-Out Wafer Level Packaging, wire bonded, Flip Chip, stacked die using DAF or FOW, Chip-on-Wafer-on-Substrate, Ceramic Co-Fire, Printed Substrate in ceramic package, plastic encapsulated modules/BGAs).
• Strong understanding of substrate technologies (e.g., BT laminate, ABF, BeO, PTFE, KPPE, glass cloth resin), materials and manufacturing processes.
• Excellent analytical and troubleshooting skills with a keen eye for detail.
• Strong verbal and written communication skills, with the ability to work effectively in a team-oriented environment.

Nice To Haves

• Experience collaborating with OSATs and semiconductor foundries, including qualification and design feedback loops.
• Knowledge of high-speed digital interfaces (PCIe, DDR, SerDes, etc.).
• Knowledge with package-level simulation tools to analyze signal quality and timing through package interconnects.
• Experience with defense packaging techniques for extreme environmental conditions.

Responsibilities

• Lead the interconnect design for advanced electronic packaging solutions, including high-reliability flip-chip BGA, ceramic packages, multi-chip modules (MCMs), and system-in-package (SiP) architectures.
• Perform comprehensive design verification ensuring that the package design meets all functional, electrical, thermal, mechanical, and manufacturability requirements.
• Collaborate closely with substrate, material and package suppliers to align design with process capabilities and technologies to ensure design meets electrical and mechanical performance requirements.
• Support Failure Analysis (FA) and root cause investigations related to the design, assembly, or performance of a package or substrate.
• Define and develop substrate stack-ups, routing strategies, via structures, and component placement to meet electrical and mechanical specifications.
• Maintain thorough documentation of design processes, test results, and revisions to ensure clarity and consistency for release packages for manufacturing.
• Develop plans, schedules, and support technical reviews that are required to develop products from market requirement through product release.
• Provide guidance and support to junior engineers, sharing expertise and best practices in package design and development.
• Contribute to package technology roadmap and design methodology improvements.

Benefits

• Competitive salary range of $130,000 to $170,000 annually based on experience.
• 100% onsite work at Bohemia, NY office.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior
• Industry: Merchant Wholesalers, Durable Goods
• Education Level: Bachelor's degree