IC Package Designer

Data Device Corporation-posted 4 months ago
$130,000 - $170,000/Yr
Full-time • Senior
Bohemia, NY
Merchant Wholesalers, Durable Goods
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We are seeking a skilled and detail-oriented IC Package Designer to join our engineering team. The ideal candidate will have in-depth knowledge of substrate design, package layout, signal integrity, and manufacturing constraints. This role will collaborate cross-functionality with the electrical, mechanical and manufacturing design teams to develop reliable, manufacturable, and cost-effective package design.

  • Lead the interconnect design for advanced electronic packaging solutions, including high-reliability flip-chip BGA, ceramic packages, multi-chip modules (MCMs), and system-in-package (SiP) architectures.
  • Perform comprehensive design verification ensuring that the package design meets all functional, electrical, thermal, mechanical, and manufacturability requirements.
  • Collaborate closely with substrate, material and package suppliers to align design with process capabilities and technologies to ensure design meets electrical and mechanical performance requirements.
  • Support Failure Analysis (FA) and root cause investigations related to the design, assembly, or performance of a package or substrate.
  • Define and develop substrate stack-ups, routing strategies, via structures, and component placement to meet electrical and mechanical specifications.
  • Maintain thorough documentation of design processes, test results, and revisions to ensure clarity and consistency for release packages for manufacturing.
  • Develop plans, schedules, and support technical reviews that are required to develop products from market requirement through product release.
  • Provide guidance and support to junior engineers, sharing expertise and best practices in package design and development.
  • Contribute to package technology roadmap and design methodology improvements.
  • Bachelor's degree in Electrical Engineering, Material science or related field.
  • 8+ years of experience in IC package design and development.
  • Experience with package design tools from concept through release (e.g., Cadence Allegro package designer).
  • Proven experience with advanced packaging technologies (e.g., 2.5D/3D, redistribution layer, interposers, HBM integration, Package-in-Package, Fan-Out Wafer Level Packaging, wire bonded, Flip Chip, stacked die using DAF or FOW, Chip-on-Wafer-on-Substrate, Ceramic Co-Fire, Printed Substrate in ceramic package, plastic encapsulated modules/BGAs).
  • Strong understanding of substrate technologies (e.g., BT laminate, ABF, BeO, PTFE, KPPE, glass cloth resin), materials and manufacturing processes.
  • Excellent analytical and troubleshooting skills with a keen eye for detail.
  • Strong verbal and written communication skills, with the ability to work effectively in a team-oriented environment.
  • Experience collaborating with OSATs and semiconductor foundries, including qualification and design feedback loops.
  • Knowledge of high-speed digital interfaces (PCIe, DDR, SerDes, etc.).
  • Knowledge with package-level simulation tools to analyze signal quality and timing through package interconnects.
  • Experience with defense packaging techniques for extreme environmental conditions.
  • Competitive salary range of $130,000 to $170,000 annually based on experience.
  • 100% onsite work at Bohemia, NY office.
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