IC Package Design Research Intern

Nokia

93d

About The Position

The IC Package Design Research Intern will be involved in various aspects of integrated circuit packaging design and research. This internship is designed to provide hands-on experience in the field, allowing the intern to work closely with experienced professionals and contribute to ongoing projects. The position is on-site and will last for a duration of 10 weeks, from June 1 to August 7, 2026.

Requirements

• Currently pursuing an MS or PhD in electrical engineering, materials science, applied physics, or a related field.
• Enrollment at an accredited school in the USA.

Responsibilities

• Assist in the design and development of integrated circuit packages.
• Conduct research on materials and methods for IC packaging.
• Collaborate with team members on various projects.
• Participate in meetings and contribute ideas for design improvements.

What This Job Offers

• Career Level: Intern
• Education Level: Master's degree
• Number of Employees: 5,001-10,000 employees