Summer 2026 - High-Speed Mixed-Signal IC Design Engineer Intern
About The Position
Join our Advanced Data Converters Department as a High-Speed Mixed-Signal IC Design Engineer Intern, contributing to cutting-edge R&D in high-speed wireline and optical interfaces. You will leverage your expertise in fundamental analog circuit techniques and communication theories to design and optimize circuits operating from 32Gbps to 224Gbps. Under the guidance of a Technical Manager, you will engage in the full design cycle, from architectural exploration to silicon verification, pushing the boundaries of performance and innovation. This Internship Program is open to students currently enrolled in a degree-seeking University, graduating in 1-2 years with their MS or PhD degree in Electrical and Computer Engineering.
Requirements
- Enrolled in PhD degree in Electrical/Electronic Engineering OR MS degree in Electrical/Electronic Engineering
- Solid background in circuit design
- Familiar with high-speed circuit challenges
Nice To Haves
- Hands-on experience in high-speed circuit schematic and layout for wireline and optical circuit applications
- Experience using field solvers, like HFSS, CST among others
- Basic understanding of digital calibration and device physics
- Knowledge of channel analysis
- Knowledge of using AI for higher productivity or performance optimization
Responsibilities
- Perform research and development work to evaluate circuit architectures and optimize circuits for PPA
- Work with partner designers to tackle critical technical challenges
- Summarize and share research findings in the form of regular presentations
- Convert innovative work from ideas to patents and publications
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What This Job Offers
Career Level
Intern
