Head of Packaging Development Engineering
This job is no longer available
There are still lots of open positions. Let's find the one that's right for you.
About The Position
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration. As a Packaging Development Manager, you will lead our mobile silicon packaging efforts. You will plan our packaging technology development, package design, and Signal and Power Integrity (SIPI) teams. In addition, you will work with silicon Intellectual Property (IP) design teams, implementation teams, system design teams, Power Management Integrated Circuit (PMIC) teams, and power teams to architect and optimize the product Power Delivery Network (PDNs). You will also work with the internal/external high speed interface IP teams, implementation teams, and system teams to ensure all the high speed IPs (PCIe, USB, UFS, CSI, DSI, LPDDR, etc.) meet the performance goals. You will also generate and provide the hardware design guidance and support to the system teams and Automated Test Equipment (ATE) hardware teams. In this role, you will provide leadership to other silicon engineers in a changing environment to build relationships with our packaging supplier and internal operations partners. You will drive technical projects from the concept/planning stage through execution to volume production. Google's mission is to organize the world's information and make it universally accessible and useful. Our team combines the best of Google AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people's lives better through technology.
