This role serves as the integrative execution leader for the NLX platform within FoB Advanced Packaging in Dublin, CA. The position is responsible for ensuring technical excellence, regulatory compliance, and operational readiness as next-generation semiconductor packaging technologies transition from R&D and pilot environments into high-volume manufacturing. Reporting to the Head of Product Management NLX, this leader aligns engineering, software, manufacturing, regulatory, safety, service, and advanced roadmap initiatives to deliver cohesive, deployable, and commercially viable systems.
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Job Type
Full-time
Career Level
Mid Level