You will be part of the NPI team within the Wireless Semiconductor Division (WSD) of Broadcom. Cross-functional with R&D Project teams, Product engineering, Quality and Reliability Engineering teams, Packaging team and suppliers. Support products from development stage to product release. Job scope and responsibilities Lead NPI engineering build plan and documentation/instruction to Contract Manufacturer release. Analyze demand and generate build plan as well as material supporting plan for engineering samples. Active interaction with suppliers to manage build process and material flow. PCB tape out logistic management and DRC process. Managing Wafer Backend(bumping dicing & TnR) processing vendor. Oversee overall engineering material supply from forecasting, tape out, order logistic and WIP monitoring. Communicate logistic status & lead activities to meet overall program objectives/supportability. Material planning and tracking for fast-paced projects inclusive of wafers, passive components and PCB. Develop and establish integrated system to drive work efficiency.
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Job Type
Full-time
Career Level
Mid Level
Number of Employees
5,001-10,000 employees