Hardware Engineer

BroadcomSan Jose, CA
12d

About The Position

You will be part of the NPI team within the Wireless Semiconductor Division (WSD) of Broadcom. Cross-functional with R&D Project teams, Product engineering, Quality and Reliability Engineering teams, Packaging team and suppliers. Support products from development stage to product release. Job scope and responsibilities Lead NPI engineering build plan and documentation/instruction to Contract Manufacturer release. Analyze demand and generate build plan as well as material supporting plan for engineering samples. Active interaction with suppliers to manage build process and material flow. PCB tape out logistic management and DRC process. Managing Wafer Backend(bumping dicing & TnR) processing vendor. Oversee overall engineering material supply from forecasting, tape out, order logistic and WIP monitoring. Communicate logistic status & lead activities to meet overall program objectives/supportability. Material planning and tracking for fast-paced projects inclusive of wafers, passive components and PCB. Develop and establish integrated system to drive work efficiency.

Requirements

  • Bachelor’s degree in engineering field.
  • At least 5+ years of working in manufacturing environment, semiconductor industry is a plus.
  • Experienced in manufacturing environment
  • Able to collaborate with cross-functional teams to achieve project goal.
  • Proactive communication skills & attention to details.
  • Able to work in fast pace environment
  • Demonstrate multi-tasking across different projects.
  • Creative and strategic thinking in problem solving
  • Master in Microsoft excel

Responsibilities

  • Lead NPI engineering build plan and documentation/instruction to Contract Manufacturer release.
  • Analyze demand and generate build plan as well as material supporting plan for engineering samples.
  • Active interaction with suppliers to manage build process and material flow.
  • PCB tape out logistic management and DRC process.
  • Managing Wafer Backend(bumping dicing & TnR) processing vendor.
  • Oversee overall engineering material supply from forecasting, tape out, order logistic and WIP monitoring.
  • Communicate logistic status & lead activities to meet overall program objectives/supportability.
  • Material planning and tracking for fast-paced projects inclusive of wafers, passive components and PCB.
  • Develop and establish integrated system to drive work efficiency.

Benefits

  • Medical, dental and vision plans
  • 401(K) participation including company matching
  • Employee Stock Purchase Program (ESPP)
  • Employee Assistance Program (EAP)
  • company paid holidays
  • paid sick leave and vacation time
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