Hardware Development Engineer, AWS CQC - Fabrication

Amazon • Pasadena, CA

5d • Onsite

About The Position

The Amazon Web Services (AWS) Center for Quantum Computing in Pasadena, CA, is looking to hire a Hardware Development Engineer with experience in semiconductor process development – and in particular wirebonding, flip chip bonding, dicing – who will aid in AWS’s effort to bring cloud quantum computing services to its worldwide customer base. Through your work inside and outside of the cleanroom environment in the device fabrication group, you will solve problems related to the fabrication and characterization of novel quantum processors. The AWS Center for Quantum Computing recognizes that developing quantum computing is a long-term endeavor, not a quick process. The team is dedicated to tackling the significant challenges involved in building a functional quantum computer. We are approaching this ambitious goal with enthusiasm and determination. The fabrication/packaging team within AWS Center for Quantum computing is responsible for delivering quantum computing product chips. Los Angeles County applicants: Job duties for this position include: work safely and cooperatively with other employees, supervisors, and staff; adhere to standards of excellence despite stressful conditions; communicate effectively and respectfully with employees, supervisors, and staff to ensure exceptional customer service; and follow all federal, state, and local laws and Company policies. Criminal history may have a direct, adverse, and negative relationship with some of the material job duties of this position. These include the duties and responsibilities listed above, as well as the abilities to adhere to company policies, exercise sound judgment, effectively manage stress and work safely and respectfully with others, exhibit trustworthiness and professionalism, and safeguard business operations and the Company’s reputation. Pursuant to the Los Angeles County Fair Chance Ordinance, we will consider for employment qualified applicants with arrest and conviction records. Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner. Our compensation reflects the cost of labor across several US geographic markets. The base pay for this position ranges from $105,600/year in our lowest geographic market up to $185,000/year in our highest geographic market. Pay is based on a number of factors including market location and may vary depending on job-related knowledge, skills, and experience. Amazon is a total compensation company. Dependent on the position offered, equity, sign-on payments, and other forms of compensation may be provided as part of a total compensation package, in addition to a full range of medical, financial, and/or other benefits. For more information, please visit https://www.aboutamazon.com/workplace/employee-benefits . This position will remain posted until filled. Applicants should apply via our internal or external career site.

Requirements

• Bachelor's degree in mechanical engineering, electrical engineering, material science, physics or equivalent, or Bachelor's degree
• Expertise in two or more of the following processes and tools: Flip chip bonding tools, wire bonding tools, saw dicing, stealth dicing, electrical probing on wafer/die
• 4+ years of industry or academic research experience
• Basic programming skills (e.g. Python, Julia, MATLAB)
• Experience conducting sophisticated analysis of complex data and translate the results into actionable deliverables, messages, and presentations

Nice To Haves

• In addition to skills related to packaging process, great to have general working knowledge in one or more of the following device fabrication areas: photo lithography, metal/dielectric/silicon etching, metal/dielectric thin film deposition
• Experience or knowledge in superconducting microwave devices or superconducting qubits is a plus

Responsibilities

• Responsibilities include developing, improving and sustaining fabrication and packaging processes
• Analyzing inline metrology and electrical test data
• Interacting with project leads to provide feedback that continuously improves the process

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Number of Employees: 5,001-10,000 employees