Hardware Development Engineer, AWS CQC - Fabrication

Amazon•Pasadena, CA

50d•Onsite

About The Position

The Amazon Web Services (AWS) Center for Quantum Computing in Pasadena, CA, is looking to hire a Hardware Development Engineer with experience in semiconductor process development – and in particular wirebonding, flip chip bonding, dicing – who will aid in AWS’s effort to bring cloud quantum computing services to its worldwide customer base. Through your work inside and outside of the cleanroom environment in the device fabrication group, you will solve problems related to the fabrication and characterization of novel quantum processors. Key job responsibilities Responsibilities include developing, improving and sustaining fabrication and packaging processes; analyzing inline metrology and electrical test data; interacting with project leads to provide feedback that continuously improves the process. Candidates must have a demonstrated background in solid engineering principles, and must have superlative data analysis, problem solving, and communication skills. Successful candidates will have experience in dicing, wire-bonding, flip chip bonding techniques and tools. Working effectively within a team environment is critical. A day in the life The schedule is late afternoon through late night for this role, 5pm-2am for example. The initial training will be performed in the day time. Once the training is finished, the candidate is expected to work independently in the assigned hours. The candidate will spend most of the time in a cleanroom environment, in a protective suit performing hands-on packaging tasks using IC packaging equipment. The candidate will carry out packaging steps for quantum computing product chips, as well as for development projects. Export Control Requirement Due to applicable export control laws and regulations, candidates must be either a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum, or be able to obtain a US export license. If you are unsure if you meet these requirements, please apply and Amazon will review your application for eligibility. About the team The AWS Center for Quantum Computing recognizes that developing quantum computing is a long-term endeavor, not a quick process. The team is dedicated to tackling the significant challenges involved in building a functional quantum computer. We are approaching this ambitious goal with enthusiasm and determination. The fabrication/packaging team within AWS Center for Quantum computing is responsible for delivering quantum computing product chips.

Requirements

Bachelor's degree in mechanical engineering, electrical engineering, material science, physics or equivalent, or Bachelor's degree
Expertise in two or more of the following processes and tools: Flip chip bonding tools, wire bonding tools, saw dicing, stealth dicing, electrical probing on wafer/die
Candidates must be either a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum, or be able to obtain a US export license

Nice To Haves

4+ years of industry or academic research experience
Basic programming skills (e.g. Python, Julia, MATLAB)
Experience conducting sophisticated analysis of complex data and translate the results into actionable deliverables, messages, and presentations
In addition to skills related to packaging process, great to have general working knowledge in one or more of the following device fabrication areas: photo lithography, metal/dielectric/silicon etching, metal/dielectric thin film deposition
Experience or knowledge in superconducting microwave devices or superconducting qubits is a plus

Responsibilities

developing, improving and sustaining fabrication and packaging processes
analyzing inline metrology and electrical test data
interacting with project leads to provide feedback that continuously improves the process