Texas Instruments-posted 7 months ago
Dallas, TX
Computer and Electronic Product Manufacturing

This process integration engineer position is focused on development, characterization and optimization of gallium nitride (GaN) power devices. As part of TI's advanced technology development (ATD) team, the role involves close collaboration with fab/manufacturing, business units and Kilby Labs. This position requires in-depth knowledge of III-nitride materials, device physics, and reliability. Experience in development of GaN devices for normally-off operation is desired. The scope of the job includes, but not limited to: GaN device simulations (TCAD), device design, layout Fabrication flow development and characterization of GaN devices Collaboration with fab/manufacturing engineers to ensure device manufacturability Collaboration with reliability engineers to meet device reliability requirements Failure root-cause investigation for device/process/reliability/yield improvements.

  • GaN device simulations (TCAD)
  • Device design and layout
  • Fabrication flow development and characterization of GaN devices
  • Collaboration with fab/manufacturing engineers to ensure device manufacturability
  • Collaboration with reliability engineers to meet device reliability requirements
  • Failure root-cause investigation for device/process/reliability/yield improvements
  • In-depth knowledge of III-nitride materials
  • Understanding of device physics and reliability
  • Experience in development of GaN devices for normally-off operation
  • Strong understanding of high voltage power FETs and other relevant semiconductor device physics
  • Familiarity with typical analog silicon and GaN high electron mobility transistor (HEMT) process flows and the underlying process physics
  • Knowledge of electrical and materials characterization methodologies and statistical data analysis
  • Strong hands-on lab experience
  • Excellent problem solving skills
  • Excellent verbal and written communication skills
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