Field Applications Engineer - Power Interconnects

Amphenol and its Affiliated Companies

4d

About The Position

The Field Application Engineer (FAE) – Power Interconnects will provide technical support and application expertise across North America for Amphenol’s power-to-board and power-to-rack connector solutions and liquid cooling used in AI server, data center, and high-performance computing (HPC) applications. This individual will be a key technical interface between customers, sales, and product development teams, ensuring that Amphenol’s interconnect technologies meet the evolving power distribution needs of next-generation AI architectures. The role includes collaboration with hyperscale, OEM, and rack integration customers, as well as participation in industry initiatives related to high-density power delivery and AI system infrastructure standards. You will be expected to develop new business and drive new product development needs to meet the markets' technology trends, by working internally with global Product Management, Business Development and Engineering.

Requirements

• Bachelor’s degree in Electrical, Mechanical, or Mechatronic Engineering (Master’s preferred)
• 3–7 years of experience in connector design, power electronics, or related hardware integration roles
• Experience in AI data centers, rack power distribution, cooling systems, or server platform engineering strongly preferred
• Customer-facing or field engineering experience required
• Deep technical understanding of power electronics, high-current interconnects, and thermal management
• Proficiency in electrical and mechanical CAD tools (e.g., Creo, SolidWorks, AutoCAD)
• Working knowledge of electrical performance metrics such as current carrying capacity, contact resistance, derating, and impedance
• Ability to interpret electrical schematics, 3D models, and mechanical drawings
• Strong interpersonal, presentation, and communication skills for customer and cross-functional engagement
• Proficiency with Microsoft Office
• Ability to travel domestically and internationally up to 50%. Significant travel in Bay Area (CA)

Nice To Haves

• Prior involvement with industry standards or consortiums (OCP, PCIe, or similar) a plus
• Familiarity with AI compute racks, GPU servers, and power delivery architectures (e.g., 48V, blind-mate power, busbars) highly desirable
• Ability to speak Mandarin highly desired
• Location in or near Bay area (CA)
• Prefer candidate come from Data Center company focus on hardware
• Proficiency in engineering simulation tools (e.g., ANSYS, SPICE, or equivalent) nice to have.

Responsibilities

• Support AI and data center customers in the design, development, and integration of Amphenol power connector solutions into rack, server, and board-level systems
• Translate customer specifications and requirements into interconnect designs, collaborating closely with internal engineering and manufacturing teams
• Provide technical leadership in power delivery standards and participate in relevant working groups (e.g., OCP, ODCC, or hyperscaler-specific initiatives)
• Drive innovation in connector technologies for high-current, low-resistance, and high-reliability applications
• Partner with sales and business development to provide technical insight during design-in and qualification phases
• Conduct field validation, performance testing, and troubleshooting at customer sites or Amphenol labs
• Act as the voice of the customer to inform future product roadmap and technology direction
• Maintain up-to-date awareness of AI hardware trends, including rack density, power efficiency, and modular architecture developments

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Number of Employees: 5,001-10,000 employees