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As a Failure Analysis Engineer, you will stand at the intersection of process development, yield enhancement, and reliability, serving as a critical resource for driving continuous improvement within semiconductor manufacturing. Your primary responsibility will be to meticulously analyze and characterize defects that impact device performance, employing a diverse range of advanced material characterization techniques. This includes leveraging sophisticated tools such as SEM, FIB, TEM, EDS, XPS, and AFM to delve into the intricate details of material microstructure and surface properties. Through failure analysis, you will identify defect patterns and trends, carefully organizing and managing microscopic images to facilitate correlative and root-cause studies. You will collaborate closely with process development, process integration, yield, and reliability teams, providing actionable insights and recommendations for process improvements. Additionally, you will contribute to the development and optimization of failure analysis protocols, staying abreast of the latest advancements in analytical techniques. Ultimately, your role will be to unravel the mysteries of device failures, providing the essential information needed to enhance product quality, yield, and reliability.
