Failure Analysis Engineer (FAE)
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About The Position
The Failure Analysis Engineer (FAE) position at Broadcom is a critical role within the Global Operations Quality Assurance team, focusing on semiconductor failure analysis. This position requires a highly motivated engineer who can work independently as well as collaboratively within a team. The FAE will engage in hands-on root cause failure analysis, utilizing a variety of advanced techniques to support cutting-edge technologies, particularly in the realm of AI infrastructure network solutions. The role demands a self-driven individual with a strong desire to tackle complex problems, and effective communication skills are essential for success in this position. The responsibilities of the FAE encompass the entire failure analysis process, starting from fault localization to electrical and physical identification and characterization. The engineer will be expected to manage multiple projects concurrently, demonstrating strong organizational skills and the ability to prioritize tasks effectively. This role offers significant opportunities for growth and development, as it supports continuously evolving technologies in the semiconductor industry. The ideal candidate will possess hands-on experience in electrical and mechanical failure analysis, including fault isolation, electrical characterization, and physical analysis, which are crucial for the role. In addition to technical expertise, the FAE should have a solid educational background, with a minimum of a Bachelor's Degree in Electrical, Mechanical, Chemical, or Materials Science, along with at least five years of relevant experience in semiconductor processing, fabrication, or assembly. The position also values team-oriented individuals who can communicate clearly and effectively, both in writing and verbally. While not mandatory, familiarity with UNIX, semiconductor packaging, and software coding in languages such as TCL, Caliber DRC, Perl, and C-Sharp is advantageous. Experience with design edit FIB operational processes, Avalon CAD database processing, and chemical/electrical lab work will also be beneficial. Key techniques relevant to the role include Photon Emission Microscopy, LSM-based localization, thermal characterization, electrical parametric/fault analysis, and physical semiconductor deprocessing using SEM and FIB techniques.
