Fab Operator

MACOM Technology Solutions Holdings, Inc.•Nashua, NH

2d•Onsite

About The Position

MACOM designs and manufactures semiconductor products for Data Center, Telecommunication and Industrial and Defense applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe and Asia. MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard. MACOM has more than 75 years of application expertise with multiple design centers, Si, GaAs and InP fabrication, manufacturing, assembly and test, and operational facilities throughout North America, Europe, and Asia. Click here to view our facilities. In addition, MACOM offers foundry services that represent a key core competency within our business. MACOM sells and distributes products globally via a sales channel comprised of a direct field sales force, authorized sales representatives and leading industry distributors. Our sales team is trained across all of our products to give our customers insights into our entire portfolio. Fab Operator Responsibilities: Works under direction and from production schedules, manufacturing procedures, process plans and written or oral instruction. Operate and set-up manual Gold wire bonders, manual eutectic/epoxy die attach systems or SMT equipment per documented work instructions. Involves working to microcircuit layout drawings; Operator is responsible for proper wire formation, bond appearance and bond strength per Mil Std 883. Operator is responsible for proper die attachment, including coverage and die shear strength per Mil Std 883. Operator is responsible for proper soldering of components – both manual and automatic per IPC-610 standards. Flexibility to be trained in multiple Microelectronics processes that involve other assembly activities. Requires significant attention to detail for production activities and documentation to maintain compliance with Mil Standard 883 requirements.

Requirements

Ability to set-up, operate and adjust or ability to learn to run a variety of microelectronic production equipment.
Minimum of 2 years' experience in microelectronics module assembly area.
High School diploma required.
Wire-bonding gold wire or ribbon to a variety of die and substrates.
Die attach using solder preforms or epoxy to a variety of components.
SMT using Mydata pick and place equipment.
Operate following all area ESD protocols.
Due to ITAR regulations, only candidates who are U.S. Persons (U.S. citizens, U.S. nationals, lawful permanent residents, or individuals granted asylum or refugee status) will be considered for this position.

Responsibilities

Works under direction and from production schedules, manufacturing procedures, process plans and written or oral instruction.
Operate and set-up manual Gold wire bonders, manual eutectic/epoxy die attach systems or SMT equipment per documented work instructions.
Involves working to microcircuit layout drawings; Operator is responsible for proper wire formation, bond appearance and bond strength per Mil Std 883.
Operator is responsible for proper die attachment, including coverage and die shear strength per Mil Std 883.
Operator is responsible for proper soldering of components – both manual and automatic per IPC-610 standards.
Flexibility to be trained in multiple Microelectronics processes that involve other assembly activities.
Requires significant attention to detail for production activities and documentation to maintain compliance with Mil Standard 883 requirements.