About The Position

About GlobalFoundries: GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com. Summary of Role: GlobalFoundries' RF Product Line is looking for engineers with industry experience in developing high performing Gallium Nitride device technologies for RF applications, and to drive innovative fab based technology development for leading edge solutions for a broad range of applications in Burlington, VT. Successful applicants will become a member of a broader center of excellence in RF technology development driving innovation across technology platforms. Engineers with a Masters or Ph. D. degree and over 8 years of industry R&D experience in Gallium Nitride or Wideband Gap Device technology are strongly preferred. Essential Responsibilities: This position offers the unique opportunity to develop innovative RF GaN technologies as a Process Integration Engineer and deliver performance and reliability demonstration across technology development qualification milestones from conception through manufacturing installation. Primary responsibilities include: developing innovative process sequences and device structures that meet our customer's performance, reliability, yield, and cost objectives. leading complex, technical projects critical to technology development project goals. DOE planning, execution, and analysis of results. Expanded responsibilities include: leading and driving teams and innovation, and leading interactions with various engineering teams across functions: device test and characterization, failure analysis, unit process module, reliability, manufacturing, and research organizations, to facilitate and achieve program success. Other Responsibilities: Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

Requirements

  • Education: Bachelor's degree in electrical engineering, chemical, materials science, or other relevant engineering or physical science discipline.
  • Years of Experience: 8+ years in industry role in semiconductor process integration, with at least 5+ years of Gallium Nitride or Wide Bandgap semiconductor process and process integration experience.
  • Demonstrated technical team leadership and program ownership, advancing the state of the art and innovation in patents and/or novel approaches.
  • Fluency in English Language – written & verbal.
  • Ability to relocate to work in Essex Junction, VT (this is not a remote position).
  • Must be able to work in the United States.

Nice To Haves

  • 8+ Years of Experience in GaN / Wide Bandgap Semiconductor process integration experience.
  • Master’s Degree or PhD in Electrical Engineering, Materials Science, Solid State Physics or other relevant engineering or physical science discipline.
  • Strong foundation of device physics and process integration interactions for GaN HEMT or GaN MISHEMT devices, or other Wide Bandgap devices.
  • Experience in GaN / Wide Bandgap device DC, AC, and RF test and characterization, as well as GaN HEMT device reliability.
  • Excellent interpersonal skills, energetic, motivated, and self-driven.
  • Demonstrate the ability to work well within a global matrixed team or environment with minimal supervision.
  • Outstanding communication skills - both written and verbal.
  • Demonstrated ability to communicate well with all levels of the organization and experience in working with external constituencies.
  • Strong organizational skills; demonstrated ability to manage multiple tasks simultaneously and able to react to shifting priorities to meet business needs.
  • Demonstrated ability to meet deadlines and commitments.

Responsibilities

  • developing innovative process sequences and device structures that meet our customer's performance, reliability, yield, and cost objectives.
  • leading complex, technical projects critical to technology development project goals.
  • DOE planning, execution, and analysis of results.
  • leading and driving teams and innovation
  • leading interactions with various engineering teams across functions: device test and characterization, failure analysis, unit process module, reliability, manufacturing, and research organizations, to facilitate and achieve program success.
  • Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
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