Equipment Engineer, Bond and Grind

Wolfspeed•Marcy, NY

1d•$67,000 - $92,000•Onsite

About The Position

At Wolfspeed, we do amazing things in a human way. We know that the achievements of our organization are due to the passion, hard work and creativity of our employees. We celebrate different perspectives to foster excellence across our organization, and our goal is to make diversity a foundation of what we do. We are proudly building an environment where you can bring your authentic self to work. Enjoy doing things that people say can’t be done? Innovation is at the center of everything we do. Hate red tape? We remove roadblocks instead of creating them. Working parent? We provide childcare assistance and paid parental leave. Student? We offer continuing education assistance. Looking for community? There are many ways to get involved, from Employee Resource Groups to local outreach. Wolfspeed is seeking a high potential, resourceful, hands-on, problem-solving Equipment Engineer with the capacity to quickly grasp and resolve a wide range of technical challenges. Wolfspeed is a powerhouse semiconductor company focused on silicon carbide and GaN technologies. After more than thirty years of forging new technology adoption and transformation, our Wolfspeed® power and radio frequency (RF) semiconductors are leading the industry through unrivaled expertise and capacity.

Requirements

Bachelor’s degree in mechanical engineering, chemical engineering, Materials Science, Nanoscale/Microelectronic Engineering or Physics. Will also consider a degree in a relevant technical field or equivalent experience within a semiconductor environment.
Understanding of and ability to handle structured problem solving 5Y and 8Ds
MS Word, MS Excel, and MS Access experience.
Strong written and oral communication skills.
Strong technical aptitude.

Nice To Haves

Previous experience working in an automated semiconductor fab
Engineering experience working with temporary bonding or wafer thinning processes

Responsibilities

Be technically adept at all things Mechanical + Electronics for various wafer processing tools such as grinders, cleaners and mounters.
Lead understanding of tool schematics and hardware configurations to eventually own troubleshooting and maintaining uptime on these tools.
Effectively use tools such as AutoCAD, Solidworks and ability to read line diagrams as well as conduct failure analysis/root cause analysis on down tools/components and design upgrade/modifications.
Conduct preventative maintenance (MTBPM), tool fingerprinting, and continuous improvement projects (CIPs) to meet tool availability goals.
Create and modify procedures and preventative maintenance specifications to increase tool availability and enhance training procedures.
Partner with process engineering and production staff to improve overall quality metrics for the fab, scrap and rework reduction, and overall cost reduction.
Create detailed tool configuration documentation, tool acceptance specifications, and assist with tool selection for capacity increases or process development/transfer.
Present technical data and project updates to peers and management.