Via Fill Operator (Grave Shift)

Summit Interconnect, Inc.•Santa Clara, CA

5h•$21 - $23

About The Position

Summit Santa Clara currently has an open position for Epoxy Via Fill Operator (3rd shift). Summit Interconnect is a manufacturer of advanced technology printed circuit boards with a specific focus on complex rigid and rigid-flex product with unique expertise in RF/Microwave applications. Understanding Summit Traveler concerning Tool numbers and Work Order numbers. Working in various areas of manufacturing, process, including but not limited to: Sanding, Via fill, Pumex, Taping, Jetscrubber and Holecheck. Qualifications: To perform this job successfully, an individual must have a minimum of one (1) year in the printed circuit board industry and must be able to perform each essential duty satisfactory. The requirements listed below are representative of the knowledge, skill and/or ability required.

Requirements

High School Diploma or equivalent.
Minimum one (1) year prior industry experience preferred.
Must have intermediate computer skills.
Must be able to read, write and speak fluent English.
Basic mathematical and reasoning ability required.
This position requires the individual to perform for the entire shift while standing.
Must be able to lift 50 lbs.
Must have very good concentration.
Must be able to remain focused with minor interruptions.

Responsibilities

Process panels per the direction of leads and/or managers.
Ensure quality.
Performs other department or company-related tasks at the direction of the department Lead.