Engineering Intern 2 - 27275
About The Position
Join HII – Mission Technologies and make a difference by joining us as an Engineering Interns for 2026. The ideal candidate will have a strong academic background in Electrical, Software, or Mechanical Engineering. In this role you will aid with design and analysis for highly complex embedded systems at the heart of various Intelligence, Surveillance, and Reconnaissance (ISR) systems. Applicants should have a high degree of flexibility and creativity to develop successful design solutions that utilize the latest embedded system techniques including microcontrollers, FPGAs, SoCs, and MPSoCs. Applicants will be involved in all stages of R&D projects as well as product development projects. U.S. citizenship required.
Requirements
- High School Diploma or equivalent + Must be working towards a Bachelor's degree with between 20% and 40% of the required credits completed.
- U.S. citizenship required.
Nice To Haves
- Defining requirements, performing schematic capture, executing or managing PCB layout, and executing design verification testing to ensure designs meet project needsMulti-Gbps serial communications links, simulation of high-speed serial communications links utilizing IBIS models, S-parameters etc.
- Power analysis; DC drop, power plane impedance, decoupling analysis
- EMI/EMC testing, debug and interpretation of results from testing and experiments
- Radar, EW, software defined radio, and electro-optical system design preferred
- Work on multi-disciplinary engineering teams
- Work in an environment with rapidly changing priorities
Responsibilities
- Research, design, development, and testing of complex electrical (digital, power, RF and analog) products or systems.
- Conduct prototype development activities to ensure compliance to specifications and project milestones.
- Promote effective design and development processes.
- Ensure optimal performance of designs.
- Create electrical/electronic schematics.
- Design complex PCBAs and/or other integrated electrical systems and components, including cabling and wire harnesses.
- Design and development of mixed signal systems with MCUs, MPUs, FPGAs, DSPs, SoCs, sensors, power electronics, analog front-end (ADC, DAC), RF front end, high speed memory.(DDR3/4), high speed serial communication (SGMII, Aurora, PCIe Gen 3, USB 3.1) and low speed serial communication interfaces (UART, I2C, SPI).
- Conduct analyses addressing issues such as failure, reliability, capacity or capability.
- Documentation of designs for internal use and consumption by other subject matter experts, other engineering disciplines and program management.
- Collaboration with other engineering disciplines and subject matter experts on system and board level design details.
- Hands on system and board level integration and testing; including the drafting of test plans and procedures, rework instructions and other documentation as needed on a design specific basis.
Benefits
- HII is more than a job - it’s an opportunity to build a new future. We offer competitive benefits such as best-in-class medical, dental and vision plan choices; wellness resources; employee assistance programs; Savings Plan Options (401(k)); financial planning tools, life insurance; employee discounts; paid holidays and paid time off; tuition reimbursement; as well as early childhood and post-secondary education scholarships.
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What This Job Offers
Job Type
Part-time
Career Level
Intern
Education Level
High school or GED
