Engineer III, Mechanical

Marotta Controls•Parsippany, NJ

13h•$108,000 - $125,000•Onsite

About The Position

Elevate your career at Marotta Controls, a New Jersey Top Workplace three years running! Dedicated to innovation, quality and excellence, we deliver cutting edge control systems for the Aerospace & Defense industry. At Marotta, we value bold thinking and teamwork, and we empower our employees to push boundaries while delivering top-tier solutions to our customers. Our team fosters a fun, collaborative culture where creativity and technical excellence thrive! Your next big opportunity starts h ere. Be part of a company where your work supports a mission that makes a difference—apply today! Mechanical Engineer III (Electronics Packaging) Job Summary of the position: The Electronics Packaging Mechanical Engineer is responsible for the physical design and construction of ruggedized electronics and ruggedized electronics enclosures. The Engineer is responsible to complete and/or contribute to the design, development, testing, qualification, and production support of products in a cost effective and timely fashion to meet the customer’s needs and schedules. The engineer shall work within a multi-disciplined organization and enlist the help of other disciplines when necessary, such as other engineers, manufacturing, purchasing, and quality assurance. Occasional light travel may be involved.

Requirements

B.S. in Mechanical Engineering is required (Advanced technical degree desirable).
8+ years design experience and technical knowledge in mechanical engineering design of electronics packaging preferably in aerospace or defense industry.
Ability to solve complex mechanical static & dynamic problems.
Works precisely, accurately, and pays close attention to all details.
High level of mechanical aptitude and knowledge.
Experience in 3D CAD solid modeling and understanding of mechanical design principle (Experience with PTC CREO desirable)
Excellent verbal/written communication skills required for multi-faceted interactions with all levels of personnel within the organization, as well as all outside agents, including but not limited to, vendors, suppliers, customers, potential job candidates, etc.
Highly computer literate, with MS Office/PC expertise, and demonstrated experience with applicable systems, programs, equipment, etc.
Design experience with electronic packaging approaches for defense and aerospace applications including:
Design for high shock and high vibration environments
Design for challenging thermal conditions
Innovative techniques for cooling electronics in a high-temperature environment (e.g. phase-change approaches).
Knowledge of IPC, WHMA, and NASA specifications for Printed Wiring Boards (PWBs), Circuit Card Assemblies (CCAs), wiring harnesses, and soldering.
Knowledge of high voltage / altitude design practices at the board and box-level.
Experience designing and testing designs to MIL-STD-810 Environments or similar (Humidity, Salt Fog, Vibration and Shock etc.)
Experience with design for manufacturability
Knowledge of manufacturing processes such as additive manufacturing, casting, milling, turning, grinding, drilling, etc.
Knowledge of PWB and CCA fabrication
Possess organizational and task management skills to work concurrent issues in parallel.
Leadership skills to interface with various other teams and disciplines at the company.
Must be a US Citizen
Experience performing analytical solutions to structural and thermal design problems using closed-form, ANSYS, ABAQUS, and/or CREO Simulate.

Responsibilities

Design and development of ruggedized electronics and electronics enclosures from a blank sheet of paper to meet customer requirements through all phases of product life cycle.
Preliminary CAD design of electronics / electronics enclosures
Interface with electrical engineers to establish sizing of circuit card assemblies and selection of materials.
Coordinate the creation of a preliminary bill of material in the business system and verifying its accuracy.
Perform, or coordinate and review, preliminary analytical results (Hand calcs and/or FEA)
Communicate technical and schedule problems, in a timely manner, to Engineering Manager / Director, Contracts Administrator, and Program Manager when applicable.
Create/Review and Approve processes for assembly, test, and related activities to the development and qualification testing of a design.
Design cost effective easily manufacturable hardware taking into account: tolerance stack-ups ease of assembly meet customer installation requirements materials of construction methods of manufacture mechanical environment (Thermal and Vibe) and Application Loading preliminary analytical results (Hand calcs and FEA) mistake proofing
Create and modify drawings with appropriate GD&T, documentation of change and effectivity, verify bill of material
Ensure accuracy of drawings.
Disposition non-conforming hardware and assist with correcting production/vendor issues.
Interface with internal and external customers to determine product changes needed for applications as a representative of the company.
Write technical documents for internal and external customers.
Participate in design reviews (internal and external)
Lead failure investigations of designs as required.
Support new business pursuits that address program technical requirements and associated schedule and costs.
Mentor and Guide Junior team members