Engineer I - Materials

Microchip Technology Inc.Lowell, MA
1d

About The Position

We are seeking a motivated Manufacturing Engineer I with a strong background in Materials Science or Materials Engineering who enjoys working in a collaborative team environment. This is an entry-level opportunity ideal for recent college BS graduates. In this role, you will support engineering efforts related to semiconductor devices and manufacturing assembly, with a primary focus on material analysis, characterization, and process–material interactions. The position is hands-on and centered on chip and wire assembly processes, while also providing strong exposure to process development, production data analysis, and continuous improvement initiatives.

Requirements

  • Bachelor’s degree in Materials Science, Materials Engineering, Mechanical Engineering, or a related engineering discipline.
  • 0 - 2.5 years of experience preferred in manufacturing, materials, or semiconductor environments preferred.
  • Will consider candidates with no experience but have relevant experience with an internship, co-op, research, or project experience in manufacturing, materials, or semiconductor environments preferred.
  • Academic or practical experience with: Material characterization techniques (e.g., microscopy, hardness testing, thermal analysis, or spectroscopy).
  • Failure analysis or reliability testing.
  • Exposure to statistical methods such as SPC, Gage R&R, DOE, 5 Why’s, or Lean/6 Sigma concepts (academic or internship experience acceptable).
  • Strong organizational skills with the ability to manage multiple assignments.
  • Effective verbal and written communication skills with the ability to work cross-functionally.
  • This job requires access to technology, materials, software or hardware that is controlled by the export laws of the United States. Candidates are required to provide proof of either US citizenship, Permanent US residency or classification as a protected individual as defined in 8 USC 1324b (a) (3).
  • Able to lift, push, pull, 25lbs, carry 15lbs, sit 10%, stand 60% walk 40 %, must be able to perform activities that include stooping, reaching, handling, hearing, talking, seeing, works alone, works around others

Nice To Haves

  • Exposure to semiconductor assembly processes such as die attach and wire bonding.
  • Familiarity with soldering materials, brazing eutectics, epoxies and encapsulation materials through coursework or lab experience.
  • Experience in using CAD, AutoCAD, SolidWorks or similar drafting software
  • Basic knowledge of industry standards such as MIL-PRF-19500, MIL-PRF-38534, or IPC standards.

Responsibilities

  • Support manufacturing and process development activities for semiconductor chip and wire assemblies, with emphasis on materials performance and reliability.
  • Evaluate and characterize materials used in semiconductor assembly, including solders, brazes, epoxies, and encapsulation compounds.
  • Partner with Operations and Engineering teams to troubleshoot manufacturing issues related to material defects, adhesion, thermal performance, and mechanical integrity.
  • Participate in root cause investigations with focus on material-related failures such as delamination, corrosion, cracking, or contamination.
  • Collect, analyze, and interpret production and material test data to identify opportunities for yield improvement and defect reduction.
  • Support continuous improvement initiatives using statistical tools and structured problem-solving methods.
  • Create and revise process documentation, work instructions, and training materials related to materials handling and processing.
  • Learn and apply industry standards relevant to semiconductor assembly and materials reliability.

Benefits

  • We offer a total compensation package that ranks among the best in the industry. It consists of competitive base pay, restricted stock units, and quarterly bonus payments. In addition to these components, our package includes health benefits that begin day one, retirement savings plans, and an industry leading ESPP program with a 2 year look back feature.
© 2024 Teal Labs, Inc
Privacy PolicyTerms of Service