SkyWater Technology is seeking a Plating Process Development Engineer to take responsibility for establishing and managing electroplating and metal wet etch processes at our Florida Advanced Packaging facility. In this position, you will focus on developing and enhancing processes for integrated Advanced Packaging process sequences and cutting-edge Heterogeneous Integration (HI) platform technologies. These include Hybrid Bonding, Direct Bond Interconnect (DBI), 2.5D and 3D Interposer technologies, as well as Fan-Out Wafer Level Packaging (FOWLP). Join us in driving innovation within the US electronics industry.
Stand Out From the Crowd
Upload your resume and get instant feedback on how well it matches this job.
Job Type
Full-time
Career Level
Entry Level
Industry
Computer and Electronic Product Manufacturing
Education Level
Bachelor's degree
Number of Employees
501-1,000 employees