Electronics Packaging Analyst III, Telework

Lockheed Martin•Huntsville, AL

1d•Remote

About The Position

Join us at Lockheed Martin as an Electronics Packaging Engineer within our Electronics Packaging department where you will have responsibilities for electronics packaging development including mechanical design, stress and thermal analysis, an electronics and mechanical CAD (drawing development and release). Location: This position is a teleworking position. What does this role look like? Join us at Lockheed Martin as an Electronics Packaging Engineer within our Electronics Packaging department where you will have responsibilities for electronics packaging development including mechanical design, stress and thermal analysis, an electronics and mechanical CAD (drawing development and release). To be effective in this role, you will need: Experience performing preliminary and detailed level stress, thermal, and solder fatigue analysis of spacecraft & missiles flight electronic components and boxes using standardized processes and tools. Experience working in a multi-disciplined team environment to help with design trades and detailed design/analysis activity. Understanding of applicable mechanical (thermal, materials, etc.) and system level requirements/parameters. Experience supporting development for reliable, compliant flightworthy components and structural assemblies which satisfy the contractual design criteria as well as any producibility requirements defined by Manufacturing and Quality. Experience providing test input/instrumentation data to environmental test personnel and collaborating with lead engineering personnel to interpret/correlate test results. 3+ years professional experience. Why Lockheed Martin? Our employees play an active role in strengthening the quality of life where we live and work by volunteering more than 850,000 hours annually. Learn more about Lockheed Martin’s comprehensive benefits package . Find out more on how we proudly support Hiring Our Heroes . At Space we value your skills, training, and education. We believe that by applying the highest standards of business ethics and visionary thinking, everything is within our reach – and yours as a Lockheed Martin Space employee… join us to experience your future! Let’s do Space!

Requirements

Experience performing preliminary and detailed level stress, thermal, and solder fatigue analysis of spacecraft & missiles flight electronic components and boxes using standardized processes and tools.
Experience working in a multi-disciplined team environment to help with design trades and detailed design/analysis activity.
Understanding of applicable mechanical (thermal, materials, etc.) and system level requirements/parameters.
Experience supporting development for reliable, compliant flightworthy components and structural assemblies which satisfy the contractual design criteria as well as any producibility requirements defined by Manufacturing and Quality.
Experience providing test input/instrumentation data to environmental test personnel and collaborating with lead engineering personnel to interpret/correlate test results.
3+ years professional experience.
Bachelor of Science or higher from an accredited college in Mechanical Engineering or related discipline, or equivalent experience/combined education.
Understand the basics of electronics packaging analysis, either through education or work experience, and be willing to learn and apply new/advanced analytical techniques necessary to perform various analysis tasks.
Knowledge of and applicable experience with spacecraft or missiles analysis methods, specifically for electronic components, and including hand calculations
Experience with finite element modeling for random vibration and thermal analysis

Nice To Haves

Ability to work in a collaborative and highly integrated team environment.
Experience with thermal and structural fatigue analysis of electronic components and attachments.
Experience with NASTRAN, NX Advanced Simulation, Abaqus, Matlab, Mathcad and CREO.
Static, vibration, acoustic, modal, shock, thermal test experience of aerospace flight hardware.
Familiarity with different electronic package types and mounting methods.
Possess good communication, both oral and written, social and presentation skills.
Proficient in Microsoft Office, especially Excel.