Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. As an intern in Package Physical Design you will support high-speed IO and power distribution network routing as well as define methodologies for the validation of Tenstorrent’s chiplet package designs. This role is on-site, based out of Toronto.
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Career Level
Intern
Education Level
Bachelor's degree
Number of Employees
501-1,000 employees