The Electroless Cuposit Operator plays a key role in the application and maintenance of the Electroless Cuposit process, a specialized chemical plating method used to deposit a uniform, conductive copper layer on non-conductive surfaces in printed circuit board (PCB) manufacturing. This process is essential for forming interconnects through vias and drilled holes prior to electrolytic copper plating. This position is responsible for preparing panels, managing the chemical bath parameters, analyzing process performance, and ensuring the Electroless Cuposit process meets production, quality, and reliability standards.
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Job Type
Full-time
Career Level
Mid Level
Education Level
High school or GED