The timing business R&D in the MSS division drives many exciting technologies that define wired and wireless connectivity across the globe. The systems team in the R&D unit is looking for a talented EE Summer Intern - 2026. The systems projects span new product definition, new chip bring-up, validation, creating FPGA IPs for our next-generation product reference designs, co-developing solutions for IEEE-1588, PCIe applications, and modeling important chip performance parameters like cross-talk, signal integrity, package thermal conductivity, crystal /resonator parameters, to name a few broad topics. Term: Summer Intern (May '26- Aug '26)
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Career Level
Intern
Industry
Computer and Electronic Product Manufacturing
Education Level
No Education Listed
Number of Employees
1,001-5,000 employees