Electrical Design Engineer

KLA•Milpitas, CA

About The Position

KLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. Virtually every electronic device in the world is produced using our technologies. No laptop, smartphone, wearable device, voice-controlled gadget, flexible screen, VR device or smart car would have made it into your hands without us. KLA invents systems and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. The innovative ideas and devices that are advancing humanity all begin with inspiration, research and development. KLA focuses more than average on innovation and we invest 15% of sales back into R&D. Our expert teams of physicists, engineers, data scientists and problem-solvers work together with the world’s leading technology providers to accelerate the delivery of tomorrow’s electronic devices. Life here is exciting and our teams thrive on tackling really hard problems. There is never a dull moment with us. Group/Division With over 40 years of semiconductor process control experience, chipmakers around the globe rely on KLA to ensure that their fabs ramp next-generation devices to volume production quickly and cost-effectively. Enabling the movement towards advanced chip design, KLA's Global Products Group (GPG), which is responsible for creating all of KLA’s metrology and inspection products, is looking for the best and the brightest research scientist, software engineers, application development engineers, and senior product technology process engineers. The Broadband Plasma Division (BBP) provides market-leading patterned wafer optical inspection systems for leading-edge IC manufacturing. Logic, foundry, and memory customers depend on BBP products to detect yield-critical defects for process debug and excursion monitoring at advanced process nodes. BBP flagship products include the 29xx and 39xx series which leverage Broadband Plasma technology to capture a wide range of defects with ultimate sensitivity at the optical inspection speeds needed for inline defect monitoring.

Requirements

A minimum of two years’ relevant industry experience in board-level circuit design
Proficient knowledge of electronic components and their characteristics
Experience with schematic capture tools and circuit simulation software (e.g., SPICE)
Hands-on experience with electronics laboratory equipment such as oscilloscope, spectrum analyzer, signal generator, and etc.
Strong understanding of RF and analog circuit design principles
Familiarity with high-speed digital design techniques
Competence in programming and scripting languages
Demonstrated ability to work both independently and collaboratively within multidisciplinary, multicultural global teams
Proficient oral and written communication skills.
Demonstrated analytical and organizational abilities.
Capable of effective collaboration with others.
Able to communicate clearly with internal teams, division management, and external customers.
Self-directed while contributing as a team member.

Responsibilities

Selection and characterization of electronic components
Execution of electronics subsystem design activities, including schematic capture, printed circuit board layout, and assembly prototyping
Circuit debugging and diagnostic procedures
Development of diagnostic scripts for PCA qualification testing
Contribution to system and subsystem integration initiatives
Subsystem qualification testing to ensure reliability
Collaboration with manufacturing and service teams to facilitate smooth product transition into manufacturing