University of Texas at Austin-posted 2 months ago
Full-time • Director
Austin, TX
251-500 employees

The Texas Institute for Electronics (TIE) is a University of Texas at Austin-supported semiconductor consortium of state and local government, preeminent defense electronics and semiconductor companies, national labs and nationally recognized academic institutions. Our mission is to develop and execute a state-of-the-art 3D Heterogenous Integration manufacturing technology roadmap, and to provide critical pilot manufacturing capabilities to address national security needs and catalyze domestic economic growth. Join the Texas Institute for Electronics (TIE) and help us push the boundaries in critical semiconductor domains, including advanced packaging, with the aim of reestablishing U.S. prominence in semiconductor manufacturing. With over $1 billion in funding from the US DoD and the state of Texas, we’re at the forefront of creating cutting-edge semiconductor manufacturing equipment and processes that will set the course for future advancements in semiconductor logic, memory, heterogeneous integration, chip cooling and more. Situated in the heart of Austin — named “America’s Coolest City” by Expedia and “The Best Place to Live in the U.S.” by U.S. News and World Report — the Texas Institute for Electronics embodies the city’s innovative spirit. UT Austin, recognized by Forbes as one of America’s Best Large Employers, provides outstanding employee benefits and total rewards packages.

  • Provides vision and direction in developing pathfinding programs in advanced heterogenous integration.
  • Identifies key priorities in advanced semiconductor technology to ensure that TIE creates immediate and long-term impact in the semiconductor design and manufacturing sector.
  • Manage a multi-disciplinary, highly qualified team to achieve TIE research development and strategic goals.
  • Oversees development of semiconductor process flows that will advance the state-of-the-art in critical semiconductor domains such as advanced packaging.
  • Bachelor’s degree in materials science, chemical engineering, electrical engineering, mechanical engineering, or other relevant discipline.
  • Fifteen (15) years of work experience in semiconductor fabrication, including at least 5 years of managing or supervising programs.
  • Significant exposure to pathfinding programs, including exploring novel materials and processes, and process integration R&D.
  • Goal-oriented and ability to prioritize and multitask.
  • Excellent written and verbal communication skills.
  • Ability to work well in teams.
  • Graduate or more years of experience working with standard semiconductor processes for patterning, wet and dry etching, deposition, metrology, and characterization.
  • Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)
  • Voluntary Vision, Dental, Life, and Disability insurance options
  • Generous paid vacation, sick time, and holidays
  • Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds
  • Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)
  • Flexible spending account options for medical and childcare expenses
  • Robust free training access through LinkedIn Learning plus professional conference opportunities
  • Tuition assistance
  • Expansive employee discount program including athletic tickets
  • Free access to UT Austin's libraries and museums with staff ID card
  • Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card
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