Digital/Mixed Signal Design Electrical Engineer

LynkChantilly, VA
Onsite

About The Position

As an Electrical Engineer at Lynk, you will function in many roles to use and expand your knowledge of electronics and PCB design. You will be responsible for analysis, schematic capture, and layout of complex mixed signal PCBAs intended for use in Lynk designed spacecraft. These boards often contain some combination of high pincount FPGAs, SoCs, and ADC/DACs, and you will be responsible for collaborating with other hardware and firmware engineers to oversee board bring-up. Candidates should be comfortable working in both a design and laboratory environment, and have experience designing systems intended for harsh environments.

Requirements

  • A bachelor’s degree or higher in Electrical or Computer Engineering
  • 10+ years experience designing complex mixed signal PCBs for harsh environments with high pincount components (FPGAs, SoCs, etc.)
  • Experience with board bring-up and testing.
  • Experience with 1 or more PCB design tool
  • Understanding of FPGA hardware requirements, including power distribution, high speed SERDES routing, memory interfaces, etc.
  • Strong grasp of Design for Manufacturing (DFM) and Design for Test (DFT) in low-to-medium volume, high-complexity production.
  • Basic knowledge of RTL/firmware development
  • To comply with U.S. Government export control regulations (ITAR), applicants must be one of the following: (i) a U.S. citizen or national, (ii) a lawful permanent resident (green card holder), (iii) a refugee under 8 U.S.C. § 1157, or (iv) an asylee under 8 U.S.C. § 1158. Individuals who do not meet these criteria must be eligible to obtain the necessary authorizations from the U.S. Department of State. For more information, please refer to the ITAR guidelines.

Nice To Haves

  • Altium is a preferred

Responsibilities

  • Hardware Architecture: Design multi-layer mixed signal PCBs featuring high-pin-count FPGAs and ADC/DACs.
  • High-Speed Design: Implement high-speed interfaces such as PCIe Gen 4/5, DDR memory interfaces, and 10/40/100G Ethernet.
  • Ruggedization: Design for harsh environments (thermal cycles, mechanical shock, vibration, etc.).
  • Power Integrity: Develop complex power trees capable of delivering high current at low voltages.
  • Signal Integrity (SI) & Power Integrity (PI): Perform pre- and post-layout simulations to ensure timing closure and link reliability.
  • Firmware: Collaborate closely with RTL teams to define pinouts, bank voltages, and clocking architectures that optimize PCB routing.
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