At 28nm and below, photolithography cannot simply print a chip design as drawn but rather optical diffraction causes critical features to print incorrectly, with direct consequences to yield and device performance. Solving that problem is your job. As a DFM/OPC Engineer in TI’s Resolution Enhancement Techniques (RET) team within ATD, you are the technical authority responsible for bridging the gap between what designers draw and what the fab can reliably print. You’ll develop, optimize, and deploy Optical Proximity Correction (OPC) models and Design for Manufacturability (DFM) solutions that ensure every product tapeout can be accurately realized in silicon at 28nm at yield entitlement. This role sits at the intersection of computational lithography, layout design, and process integration; your work is a prerequisite for every analog product TI ships from LFAB.
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Job Type
Full-time
Career Level
Entry Level
Education Level
No Education Listed