Design-for-Reliability Engineer

Cerebras SystemsSunnyvale, CA
34d

About The Position

Cerebras Systems builds the world's largest AI chip, 56 times larger than GPUs. Our novel wafer-scale architecture provides the AI compute power of dozens of GPUs on a single chip, with the programming simplicity of a single device. This approach allows Cerebras to deliver industry-leading training and inference speeds and empowers machine learning users to effortlessly run large-scale ML applications, without the hassle of managing hundreds of GPUs or TPUs. Cerebras' current customers include global corporations across multiple industries, national labs, and top-tier healthcare systems. In January, we announced a multi-year, multi-million-dollar partnership with Mayo Clinic, underscoring our commitment to transforming AI applications across various fields. In August, we launched Cerebras Inference, the fastest Generative AI inference solution in the world, over 10 times faster than GPU-based hyperscale cloud inference services.

Requirements

  • Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.
  • 5+ years of experience in Design for Reliability (DfR) for complex electronics systems.
  • Deep technical expertise in electronics component and system reliability, including failure modes for PCBs (e.g. solder joint fatigue, via cracking, corrosion) and system-level risks (e.g. thermal mismatch, vibration, power noise).
  • Experience designing failure mode-driven accelerated life tests for chips, packaging, or systems, based on first principles fundamentals.
  • Familiarity with statistical software for reliability (e.g. JMP, ReliaSoft suite) and with reliability simulation tools (e.g. Ansys Sherlock, COMSOL).
  • Demonstrated ability to lead cross-functional teams and facilitate FMEAs.

Nice To Haves

  • Master’s or PhD in a relevant field.
  • Coding experience for reliability modeling and data analysis (e.g. Python).
  • Knowledge of advanced IC packaging technologies.

Responsibilities

  • Drive reliability excellence across system designs (semiconductors, power delivery, thermal management, advanced packaging, PCBs, etc.) from concept to production, using a first-principles approach.
  • Address key reliability risks early in the development process by embedding reliability requirements into design specifications and BOM selection.
  • Develop and execute accelerated life tests for components, sub-assemblies, and systems.
  • Apply physics-of-failure models and tools to predict reliability under operational stresses, and quantify the impact of design choices.
  • Simulate reliability of complex electronic systems using software such as Ansys Sherlock.
  • Lead FMEA (Failure Modes and Effects Analysis) and other risk analysis methodologies to identify reliability risks, prioritize mitigation strategies, and translate root-cause findings from failure analysis into design/process improvements.
  • Champion reliability culture through training, tool development, and data-driven recommendations to stakeholders, including executive leadership.
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