At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology. Job Description Summary: Hands on experience with 2.5/3DIC system planning, including exploration. MSA – Si, Pi, Thermal and stress/fatigue analysis Package design using Cadence APD, including IC package co-design. Job Description: We are looking for a highly skilled and motivated 3DIC Design Flow Engineer to implement system planning and integration of complex HPC and AI systems with chiplets. You will be responsible for developing and implementing advanced solutions for high-performance AI applications. This is a challenging and rewarding opportunity for a highly motivated engineer with a passion for innovation and a proven track record of success in the semiconductor industry. The engineer will design and implement 3DIC-compatible flows by collaborating with electronic design automation (EDA) tool developers, analog/digital/3DIC design teams, modeling teams, advanced packaging and 3DIC technology teams. The position requires expertise in System Design, 3DIC integration, and EDA tool enablement.
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Job Type
Full-time
Career Level
Mid Level