Join our dynamic DFT and Verification team at TSMC, where you will play a pivotal role in the development and validation of cutting-edge logic test chips. These chips are instrumental for pioneering yield learning in advanced process nodes and pushing the boundaries of advanced packaging technologies. This internship offers a unique opportunity to tackle complex, real-world challenges at the forefront of semiconductor innovation. This program is designed for exceptional students currently pursuing a Master’s or Ph.D. degree in Electrical or Computer Engineering, with an expected graduation date in 2026 or 2027. The internship will commence in Summer 2026 and continue through Fall 2026, providing a substantial period for impactful contributions and learning.
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Career Level
Intern
Education Level
Ph.D. or professional degree