Defect & Yield Metrology Engineer

Intel Corporation • Chandler, AZ

1d • Onsite

About The Position

Position Overview We are seeking a motivated and skilled engineer to join our SPTD Yield team as a Micro-contamination Expert and Defect Metrology Engineer. In this role, you will drive innovation in EMIB-T, glass core, EMIB scaling, and panel-level packaging technologies for substrate and assembly test factories serving Intel's IPG and IFS customers. Our mission is to become the supplier of choice for advanced, cost-effective substrate packaging by developing leading-edge systems, process capabilities, and inspection technologies that achieve top yields.

Requirements

• Bachelor's degree in Electrical Engineering, Chemical Engineering, Optical Engineering, Materials Science, Physics, or related field + 5 years semiconductor experience OR Master's degree in Electrical Engineering, Chemical Engineering, Optical Engineering, Materials Science, Physics + 2 years semiconductor experience OR PhD in Electrical Engineering, Chemical Engineering, Optical Engineering, Materials Science, Physics + 1+ years semiconductor experience
• Experience with yield analysis, JMP/Python scripting, and equipment troubleshooting
• Experience in micro-contamination management within semiconductor manufacturing
• Experience as a yield or defect reduction owner with prior defect metrology tool ownership

Nice To Haves

• Experience statistics and experimental design with application to tool qualification and process development
• Experience with semiconductor process flows and/or defect metrology assessment based on process requirements

Responsibilities

• Defect Detection & Process Improvement Utilize defect inspection tools to detect and resolve process issues
• Collaborate with defect reduction, process integration, and module teams to improve yield
• Apply real-time data analysis, reporting, and DOE summaries to guide improvements and decision-making
• Micro-contamination Expertise Apply advanced contamination detection and control strategies to maintain substrate and process quality
• Lead efforts to monitor and reduce contamination, ensuring high yield and quality standards
• Maintain flexibility and adaptability to support evolving demands in micro-contamination management
• Tool Installation & Development Direct next-generation tool installation through major milestones: p-spec development, source inspection, design, prefac, SL1/SL2, IQ, SQ, and MRCL
• Collaborate with diverse stakeholders throughout the installation process
• Independent Leadership & Problem-Solving Manage work independently with minimal supervision
• Proactively identify and resolve issues
• Provide leadership in both defect metrology and micro-contamination initiatives
• Factory Operations & Equipment Management Work with factory teams and module partners to maintain WIP velocity targets
• Develop and implement procedures and equipment setups for defect metrology tools
• Set up data flows for new tools by connecting them to automation and yield analysis systems
• Strategic Planning & Collaboration Create equipment roadmaps supporting capabilities that match program requirements for new substrate technologies
• Collaborate with equipment suppliers and GSEM partners to maintain and enhance current toolsets
• Present critical tool and system capabilities to APTM leadership

Benefits

• We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
• Find out more about the benefits of working at Intel.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Number of Employees: 5,001-10,000 employees