DCP Equipment Engineering Intern - Summer 2026

NXP Semiconductor, Inc. • Austin, TX

30d • Onsite

About The Position

Summer Engineering internship at NXP's ATMC wafer manufacturing facility Approximately 12 weeks long Learn the basics of semiconductor manufacturing, technology and operations Work with an experienced engineer mentor to troubleshoot production equipment and process issues within the factory Drive one or more real projects urgently needed by the fab related to key business metrics (Safety, Quality, Delivery, Cost) Deliver real results to the business and present to factory senior management at the end of the internship Equipment engineering will optimize the multi-million dollar production equipment (parts, preventative maintenance, cleaning and repair, etc.) Process engineering will optimize the processes (materials, time, temperature, dose, etc.) of the various manufacturing steps

Requirements

• Must be currently working towards a BS in Engineering (Mechanical, Materials Science, Chemical or Electrical Engineering preferred)
• A desire to learn about the semiconductor industry.
• Strong verbal and written communication skills.
• Good problem-solving skills.
• Self-motivated; able to take initiative and work with a mentor.
• Excellent interpersonal skills.

Responsibilities

• Troubleshoot production equipment and process issues
• Drive projects related to key business metrics (Safety, Quality, Delivery, Cost)
• Optimize multi-million dollar production equipment (parts, preventative maintenance, cleaning and repair, etc.)
• Optimize the processes (materials, time, temperature, dose, etc.) of the various manufacturing steps
• Work with cross functional teams to accomplish testing, improving tool performance, tool installs, tool removals, tool moves.

What This Job Offers

• Career Level: Intern
• Industry: Computer and Electronic Product Manufacturing
• Number of Employees: 5,001-10,000 employees