About The Position

CPO architect for packaging, optical alignment and test

Requirements

  • Master's or PhD in Mechanical Engineering, Electrical Engineering, Materials Science, or related field.
  • Experience in developing and deploying silicon photonics solutions to the market.
  • Experience in developing photonics coupler assembly, testing, and DFM.
  • Over 5 years of experience in semiconductor technology development roles.
  • Over 5 years of experience collaborating with manufacturing partners, including suppliers, OSATs, and foundries.
  • In-depth knowledge of various packaging architectures, such as 3D die stacking, 2.5D CoWoS, and fan-out packaging.

Responsibilities

  • Collaborate with product architects in the early definition stage to understand and define package architectures and roadmaps.
  • Partner with the design team and external vendors to develop package solutions, including FAU and supporting mechanical components, to meet product requirements.
  • Define mechanical test vehicles to establish design rules and DFM/DFY guidelines.

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What This Job Offers

Industry

Computer and Electronic Product Manufacturing

Number of Employees

5,001-10,000 employees

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