CPO architect for packaging, optical alignment and test
MediaTek•San Jose, CA
54d
About The Position
CPO architect for packaging, optical alignment and test
Requirements
- Master's or PhD in Mechanical Engineering, Electrical Engineering, Materials Science, or related field.
- Experience in developing and deploying silicon photonics solutions to the market.
- Experience in developing photonics coupler assembly, testing, and DFM.
- Over 5 years of experience in semiconductor technology development roles.
- Over 5 years of experience collaborating with manufacturing partners, including suppliers, OSATs, and foundries.
- In-depth knowledge of various packaging architectures, such as 3D die stacking, 2.5D CoWoS, and fan-out packaging.
Responsibilities
- Collaborate with product architects in the early definition stage to understand and define package architectures and roadmaps.
- Partner with the design team and external vendors to develop package solutions, including FAU and supporting mechanical components, to meet product requirements.
- Define mechanical test vehicles to establish design rules and DFM/DFY guidelines.
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What This Job Offers
Industry
Computer and Electronic Product Manufacturing
Number of Employees
5,001-10,000 employees
