Copper Plating Engineering Group Leader

3D Glass Solutions, Inc-•Albuquerque, NM

25d•Onsite

About The Position

The Copper Plating Engineering Group Leader is a hands-on leader who will lead process development and provide manufacturing support for advanced copper plating technologies. This role requires deep technical expertise in electroplating and electroless copper processes, strong experimental leadership, and the ability to mentor and guide a team of process engineers. The ideal candidate will be both a technical authority and an active contributor in lab and fab environments.

Requirements

Bachelor’s degree or higher in Materials Science, Chemical Engineering, Electrical Engineering, or a related field required.
5-10 years of industry experience in copper plating or advanced packaging process engineering.
Willing to relocate to Albuquerque, New Mexico, for 1-2 years and willing to relocate to India for 2 years or permanently.
This position will require lawful access to ITAR/EAR controlled information, and employees in these roles will need to meet those requirements. Requirements include US Citizenship, US Permanent Resident, or the ability to meet contract-specific licensure requirements.
Demonstrated experience leading technical teams or serving as a senior technical authority.
Proven track record of solving complex plating and integration challenges.
Experience with plating equipment operation, optimization, and qualification.
Experience with plating chemistry additives, including suppressors, accelerators, and levelers.
Knowledge of wafer-level and/or panel-level plating process development and manufacturing.
Knowledge of microvia electroplating and void-free fill techniques.
Knowledge of plating seed layer etching and related metallization removal processes.
Experience in through Glass Via (TGV) filling.
Familiarity with high-volume manufacturing requirements and process control methodologies.
Ability to balance technical depth with project and people leadership.
Excellent communication and mentoring skills.
Supplier and equipment vendor engagement experience.
Experience in advanced packaging, heterogeneous integration, or semiconductor manufacturing environments.
Experience in through Silicon Via (TSV) filling.
Knowledge of photoresist stripping and post-plating cleaning processes.
Experience with redistribution Layer (RDL) electroplating.
Knowledge of electroless copper plating chemistries, including copper seed layer formation.
Experience with Electroplating waveforms, including DC, pulse, and pulse-reverse plating.
Demonstrated experience with Copper electroplating chemistries, including acid copper systems and additive interactions.
Strong experimental design and data analysis skills.

Responsibilities

Lead and manage a team of process engineers focused on copper plating and related unit processes.
Drive experimental design, execution, and data analysis to optimize plating performance, yield, and reliability.
Provide hands-on technical leadership in lab and production environments, including tool setup, process tuning, and troubleshooting.
Develop, qualify, and maintain copper plating processes for wafer-level and/or panel-level manufacturing.
Serve as the technical owner for copper electroplating and electroless plating modules.
Collaborate cross-functionally with equipment, integration, yield, reliability, and manufacturing teams.
Establish robust problem-solving methodologies (DOE, SPC, FMEA, root cause analysis) to address process challenges.
Support technology transfers from R&D to high-volume manufacturing
Mentor junior engineers and elevate the overall team's technical capability
Interface with chemical and equipment suppliers for process optimization and roadmap alignment.
Perform additional functions and other duties as assigned or required.